Romanian Journal of Information Science and Technology (ROMJIST)

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ROMJIST is a publication of Romanian Academy,
Section for Information Science and Technology

Editor – in – Chief:
Academician Dan Dascalu

Secretariate (office):
Adriana Neagu
Adress for correspondence: romjist@nano-link.net (after 1st of January, 2019)

Editing of the printed version: Mihaela Marian (Publishing House of the Romanian Academy, Bucharest)

Technical editor
of the on-line version:
Lucian Milea (University POLITEHNICA of Bucharest)

Sponsors:
• National Institute for R & D
in Microtechnologies
(IMT Bucharest), www.imt.ro
• Association for Generic
and Industrial Technologies (ASTEGI), www.astegi.ro

ROMJIST Volume 22, No. 2, 2019, pp. 111-123, Paper no. 622/2019
 

A.C. Bunea, D. Neculoiu, A.M. Dinescu
Packaging approaches for GaN/Si SAW Band Pass Filters with Operating Frequencies above 5 GHz

ABSTRACT: This paper presents two packaging approaches for surface acoustic wave band pass filters (SAW-BPF) processed on GaN/Si and operating at frequencies above 5 GHz. One approach is based on a surface mount device (SMD) quad flat no-leads (QFN) ceramic package available off-the-shelf for applications up to few GHz. The other approach is based on quasi-wafer level packaging (quasi-WLP), using a PMMA cap and epoxy resin glue to cover only the sensitive area of the SAW-BPF. The two packages are evaluated using a coplanar waveguide transmission line (CPW-TL) as test vehicle. The ceramic SMD QFN package shows additional losses lower than 1 dB up to 6 GHz, while the PMMA quasi-WLP shows additional losses lower than 0.1 dB up to 30 GHz. SAW-BFPs with operating frequencies around 5.5 GHz are packaged using the two approaches and measurement data shows little effect on the main SAW-BPF parameters.

KEYWORDS: band pass filters, ceramic package, coplanar waveguide, gallium nitride, packaging, PMMA, surface acoustic wave, surface mount device, wafer level packaging

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