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Giorgio DE PASQUALE, Mian WEI
Nickel MEMS Energy Harvesters for the Self-Powering of Vehicular Sensing Systems
pp. 3–21

Abstract. MEMS energy harvesters are attracting researchers’ attentions from both academia and industries for the self-powering of sensing systems in vehicular applications. The possibility to convert the power contained in the mechanical vibrations into electrical power offers the possibility to replace traditional wired sensors with wireless devices, to simplify the on-board architecture, increase maintainability and reduce operative and supplying costs. This work describes the design and fabrication of vibrating harvesters using electroplated nickel as the structural material; a modular approach is proposed for the mask definition of compact self-powered sensing systems. The capacitive transduction principle is adopted for ease of fabrication and efficient conversion. In addition, some strategies to improve the dynamic performances in terms of resonance frequency tuning and bandwidth amplification are also presented. Read the pdf

 

 

 

 

 

 

 

 

 

 

 

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Mladen BOŽANIĆ, Saurabh SINHA, Alexandru MüLLER
Streamlined Design of SiGe Based Power Amplifiers
pp. 22–32

Abstract. This paper presents a streamlined design flow for an integrated power amplifier. For a given set of amplifier specifications and BiCMOS process parameters, a software routine computes passive component values for a Class-E or Class-F based power amplifier. The routine includes a matching network for standard impedance loads. Spiral inductor search algorithm is used to generate inductors with Q-factors optimised at a desired frequency. Operation of the software routine is demonstrated by simulations in Austriamicrosystems 0.35 µm single-supply process for the 10 dBm, 2.4 GHz power amplifier design. Read the pdf

 

 

 

 

 

 

 

 

 

 

 

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Biagio DE VIVO, Patrizia LAMBERTI, Giovanni SPINELLI, Vincenzo TUCCI
A Simulation Tool for the Evaluation of the Performances of A Nanointerconnect Based on SWCNT
pp. 33–48

Abstract. A simple approach based on the commercial package PSIM® is used for simulating the behaviour of a principle InterConnect (IC) based on a Single Wall Carbon NanoTube(SWCNT) modelled by an equivalent Transmission Line (TL). The simulator is also employed for computing all the per unit length parameters of the TL in terms of the geometrical, physical and thermal dependencies of the considered structure. An equivalent two port circuit is developed that can be used both for time and frequency domain analysis of the nano-ICs, including also the interesting feature of the evaluation of the performances ranges occurring in presence of characteristic parameter variations. Read the pdf

 

 

 

 

 

 

 

 

 

 

 

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Ciprian ILIESCU, Guillaume TRESSET, Liming YU, Guolin XU
3D Dielectrophoretic Chips: Trapping and Separation of Cell Populations
pp. 49–64

Abstract. The paper presents original contributions at manipulation of biological samples using electric field (dielectrophoresis). Design considerations, fabrication processes and experimental results of three original three dimensional (3D) dielectrophoretic (DEP) structures: DEP chip with 3D silicon electrodes, DEP chip with asymmetric electrodes. The paper presents also the experimental results of trapping yeast cells and the methods for separation of two cell populations developed in the above mentioned devices. Read the pdf

 

 

 

 

 

 

 

 

 

 

 

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Viorel DRĂGOI, Erkan CAKMAK, Eric PABO
Metal Wafer Bonding for MEMS Devices
pp. 65–72

Abstract. Metal films can be used as bonding layers at wafer-level in MEMS manufacturing processes for device assembly as well as just for electrical integration of different components. One has to distinguish between two categories of processes: metal thermo-compression bonding on one side, and bonding with formation of an eutectic alloy layer or an intermetallic compound. The different process principles determine also the applications area for each. From electrical interconnections to wafer-level packaging (with special emphasis on vacuum packaging) metal wafer bonding is a very important technology in MEMS manufacturing processes. Read the pdf

 

 

 

 

 

 

 

 

 

 

 

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Liviu GORAŞ, Ion VORNICU
Spatial Filtering Using Analog Parallel Architectures and Their Log-Domain Implementation
pp. 73–83

Abstract. A class of linear continuous in time and discrete in space homogeneous Cellular Neural Network type analog parallel architectures and log-domain CMOS implementation is discussed. The specific feature of the spatio-temporal dynamics of the architecture is the existence of unstable spatial modes - property that can be used for high speed image processing. The dynamics and spatial frequency response of a 1D array at system level and log-domain transistor level implementation are compared. Read the pdf

 

 

 

 

 

 

 

 

 

 

 

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Alexandr TODOSICIUC, Andrey NICORICI, Tatyana GUTSUL,
Fabian GRAMM, Leonid BRAGINSKY, Valery SHKLOVER
Study of Temperature-Based Synthesis of PbTe Nanoparticles and Their Interaction with Surfactant
pp. 84–97

Abstract. Colloidal suspensions of PbTe nanoparticles coated with oleic acid (OA) were obtained using a high-temperature solution phase (HTSP) method. Both diphenyl ether and squalane were used as high-boiling heat-transfer agents. It was shown that the change in standard synthesis conditions, such as the temperature of reaction and the group IV/group VI precursor molar ratio, led to precipitation of the nanocrystalline tellurium in parallel with PbTe nanoparticles. Bonding between the oleic acid and nanoparticles (NP) was investigated using Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS). The results indicated that oleic acid coordinated the nanoparticles symmetrically through carboxyl groups, and the interaction modes were bridging bidentate and chelating interactions. The strong coordination by the capping monolayer made the NP stable against oxidation. In contrast to bulk, nanocrystalline PbTe possesses photosensitivity to IR radiation at low temperatures enabling electrical conductivity, which itself has an activation character with rising temperature. Read the pdf

 

 

 

 

 

 

 

 

 

 

 

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Marnus WESTSTRATE, Saurabh SINHA, Dan NECULOIU
Design Trade-offs and Limitations of a LC-Ladder and Capacitive Feedback LNA and its Application at mm-Wave Frequencies
pp. 98–107

Abstract. Simulation results of a LC-ladder and capacitive feedback low noise amplifier over the 60 GHz unlicensed band is presented. A gain of 14.2 dB was obtained with S11 less than –15 dB and a noise figure of 5.2 dB. These results deviate significantly from theory however and as such possible explanations for these deviations are presented as well as a suggestion for the improvement of the mathematical model. Other design trade-offs present in very wideband designs at lower frequencies are also quantified and equations for the maximum corner frequency and bandwidth as a function of noise figure are derived. Read the pdf