D. DUBUC, K. GRENIER, M. N. DO, J. P. BUSQUERE, A. COUSTOU, B. DUCAROUGE, S. MELLE, L. MAZENQ, F. BOUCHRIHA, P. PONS, R. PLANA
3D Microsystem Integration for Microwave and Millimeter Wave Applications

Abstract.
This paper outlines the 3D microsystem integration concept of microwave and millimeterwave applications through the use of the microtechnologies. The resulting microsystems then feature high performances thanks to the combined use of the SiGe and MEMS technologies and exhibit high compactness due to a 3D integration.