ROMANIAN JOURNAL OF INFORMATION SCIENCE AND TECHNOLOGY
Volume 2, Number 1-2, 1999, 71 - 91

 

Building of Silicon Mechanical Sensors
by Bulk Micromachining and Anodic Bonding

Daniel LAPADATU, Henrik JAKOBSEN
SensoNor asa, Horten, Norway
E-mail: daniel.lepadatu@sesonor.no

 

Abstract.
This paper deals with some industrial aspects of microsensor technology and the approach taken by SensoNor in building silicon mechanical sensors. The paper gives a review of the two major technological tools employed in the fabrication of silicon mechanical sensors, micromachining and anodic bonding. To demonstrate the strength of the proven technology, several examples of feasible, low cost, highly reliable sensors are presented.