Volume 2, Numbers 1-2, 1999

CONTENTS:

Foreword
p. 3

Jumana BOUSSEY, Stephanie CHOUTEAU
Optoelectronic Integration in Silicon-on-Insulator Technologies
p. 5

Jean-Pierre CHANTE, Marie-Laure LOCATELLI, Dominique PLANSON,
Laurent OTTAVIANI, Eewan MORWAN, Karine ISOIRD, Frank NALLET
Silicon Carbide Power Devices
p. 19

Dan DASCALU
From Micro-to Nano-Technologies
p. 35

Denis FLANDRE, Danielle VANHOENACKER
Thin-Film Fully-Depleted SOI CMOS Technology, Devices and
Circuits for LVLP Analog/Digital/Microwave Applictions
p. 49

Klas HJORT
Diamond Microstructures
p. 61

Daniel LEPADATU, Henrik JAKOBSEN
Building of Silicon Mechanical Sensors by Bulk
Micromachining and Anodic Bonding
p. 71

Juin J. LIOU
Long-Term Base Current Instability: A Major Concern for
AlGaAs/GaAs HBT Reliability
p. 93

Andrei MIRCEA, Francoise ALEXANDRE, Jean DECOBERT,
Jean-Cristophe HARMAND, Abdallah OUGAZZADEN
Review and Prospects for VPE, MOVPE, MBE and CBE
(MOMBE) of InP and Related Materials
p. 107

Alexandru MULLER, Sergiu IORDANESCU
Membrane Supported Microwave Circuits
p. 116

Audroula G. NASSIOPOULOU
Low Dimensional Silicon for Integrated Optoelectronics
p. 129

Fernando RINCON, Lluis TERES
Reconfigurable Hardware Systems
p. 139

Jorg SEEKAMP, Wolfang BAUHOFER
a-SiC(O,N):H Thin Films-Their Optical Properties
and Possible Applications
p. 157

Moisey K. SHEINKMAN, Nadezhda E. KORSUNSKAYA, Sergey S. OSTAPENKO
Ultrasound Treatment as a New Way for Defect
Engineering in Semiconductor Materials and Devices
p. 173

Hilmi UNLU
A Quantum Thermochemical Modeling of Band Offsets and
Schottky Barriers of Semiconductor Heterostructures
p. 189

Andreas WILD
Modeling and Simulation for Microsuystems:
Challenges and Trends
p. 211